Developer Home Contents Search Feedback Support Intel(r)


PGA to Surface Mount Foot Print, Test Head

Interconnect Systems Inc.


Architecture:
Type :
Last Update:

i960(R) Processors HX
Hardware Accessories
6/26/97 11:30:00 AM

Vendor Information


Tool Description:

Interconnect Systems, Inc. has developed a PGA to QFP adapter mechanism ("Emulator Test Head") which allows users of Intel i960(R) processors to probe directly to the bare SMT footprint on their board assembly, thus solving a major test issue for high-end chip users contemplating the transition to a QFP package from a PGA package.

Tool Features:

  • Probes Directly to Fine-Pitch SMT Pads on Chip-Users Circuit Board

  • Non-Permanent Connection to SMT Pads

  • Pin-Compatible With Existing PGA Test Set-Ups

    • Development Platform(s):

    File Attachments:

    S960_157.PDF - Solutions960(R) Catalog Product Listing

    Supported Device Detail Matrix:

    		Part & Package

    		Availability

    		80960HA - 168ldPGA
    80960HA - 208ldSQFP
    80960HD - 168ldPGA
    80960HD - 208ldSQFP
    80960HT - 168ldPGA

    		NOW
    NOW
    NOW
    NOW
    NOW


    Vendor Information:


    Interconnect Systems Inc.

    2162 Union Place, P.O. Box 1089
    Simi Valley , CA 93065
    USA
    (805) 581-5626

    Fax : (805) 581-5032

    Contact the vendor above for the latest Distributor information



    * Legal Information © 1998 Intel Corporation